000			01678nam a22001937a 4500
082			_a660.284 _bP295S
100			_aPate!, Atri Chaturbhai _945567
245			_aStructure-property for Epoxy Nanosilica Composites _cby Atri Chaturbhai Pate!
260			_aIIT Jodhpur _bDepartment of Chemical Engineering _c2023
300			_ax, 43p. _bHB
500			_aIn this work, we are preparing nanocomposites of Epoxy-Nanosilica for electronic packaging. The main objective is to develop a polymer composite with a high glass transition temperature (Tg around 230°C) and to ensure better dispersion quality of fillers. This study shows the effect of loading and quality of filler dispersion on the cured systems' glass transition temperature. Differential scanning calorimetry (DSC), Optical microscopy (OM), Fourier transform infrared spectroscopy - Attenuated total reflectance (FTIR-ATR), Optical profilometry, and Atomic force microscopy (AFM) are characterization techniques. Spin coater and homogenizer are processing tools used as part of this work to achieve this objective. The sample, when undergoing DSC, is prevented from leaking when subjected to step curing. The increase in the percentage of silica particles results in a higher glass transition temperature. The optical microscopy images showed clumps of nanosilica in epoxy resin. Good quality of coating was achieved when the sample was spin-coated.
650			_aDepartment of Chemical Engineering _945568
650			_aNanosilica _945569
650			_aGlass Transition Temperature _945570
650			_aElectronic Packaging _945571
650			_aMTech Theses _945572
700			_aArora, Deepak _945573
942			_cTH
999			_c16607 _d16607