| 000 | 00932nmm a2200253Ii 4500 | ||
|---|---|---|---|
| 005 | 20230705152726.0 | ||
| 008 | 210504s2021 gw ob 001 0 eng d | ||
| 020 |
_a9783527824199 _q(electronic bk.) |
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| 020 |
_a3527824197 _q(electronic bk.) |
||
| 020 | _z9783527346684 | ||
| 020 |
_a9783527824182 _q(electronic bk.) |
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| 020 |
_a3527824189 _q(electronic bk.) |
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| 020 | _z3527346686 | ||
| 024 | 7 |
_a10.1002/9783527824199 _2doi |
|
| 082 |
_a621.3815/2 _223 |
||
| 100 |
_aLill, Thorsten, _eauthor. _922265 |
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| 245 |
_aAtomic layer processing : _bsemiconductor dry etching technology / _cThorsten Lill. |
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| 260 |
_aWeinheim, Germany : _bWiley-VCH, _c2021. |
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| 300 | _a1 online resource. | ||
| 504 | _aIncludes bibliographical references and index. | ||
| 590 | _bWiley Frontlist Obook All English 2021 | ||
| 650 |
_aSemiconductors _xEtching. _922266 |
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| 856 |
_uhttps://doi.org/10.1002/9783527824199 _zWiley Online Library |
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| 999 |
_c13855 _d13855 |
||