000			00584nam#a2200157ua#4500
008			190626s2019 nyua b 001 0 eng d
020			_a9789390385515
082			_a621.381 046 _bT833D
100			_aTummala, Rao R. _eeditor. _912826
245			_aFundamentals of Device and Systems Packaging _bTechnologies and applications _cedited by Rao Tummala
250			_a2nd ed.
260			_aNew Delhi _bMcGraw-Hill _c2019.
300			_axx, 828 pages _billustrations (some color) _c25 cm
504			_aIncludes bibliographical references and index.
650			_aMicroelectronic packaging. _912827
999			_c10637 _d10637