Between an electronic or electrical component and the environment, an electronic package acts as a protective barrier. Integrated circuits (ICs) and other parts are connected with it to create entire electronic systems. Multiple circuits or components on a single chip are referred to as integrated circuits (ICs), and they are categorized according to a variety of different criteria, including their material, level of integration, number of transistor elements, operational principles, manufacturing processes, and device types. Additionally, solvent sensitivity in epoxy studies is conducted to check their sensitivity. Solvents such as water, acetone, IPA, etc., can cause extensive changes in thermo-mechanical properties. Hence, detailed studies in chemistry, architecture, and solvent impact are important to check the reliability and enhancements in properties using solvents.

Epoxies are widely used in electronic packaging industries worldwide. There is a wide range of applications of materials like blends, composites, ceramics, metals, encapsulants, etc., in the electronic packaging industry. Targets such as low CTE, low dielectric roughness, higher elongation at break, along with high Tg, help improve the packaging system. Diving into the world of electronics, we see that the reliability of the packaging mainly depends on the amount of heat dissipated and the protection provided from the outside environment, with factors like moisture retention and chemical resistance being key considerations. Protecting the components of the system using a thin layer of epoxy blends is being worked upon, alongside improving the thermal and mechanical properties of the blend by adding appropriate hardeners. This involves analyzing various structure-property relationships, which means examining how changes in functionality, aromaticity, or chain length affect properties like roughness, Tg, and Tcure. The epoxies used in this work are BADGE (MY-790) and EPN-1180, which are key for the formulation.