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Systems, Software and Services Process Improvement edited by Murat Yilmaz, Paul Clarke, Andreas Riel, Richard Messnarz. [electronic resource] :

Contributor(s): Material type: TextTextPublication details: Cham Springer Nature Switzerland 2023Edition: 1st ed. 2023Description: XX, 387 p. 157 illus., 121 illus. in color. online resourceISBN:
  • 9783031423079
Subject(s): DDC classification:
  • 4.068
Online resources: Summary: This two-volume set constitutes the refereed proceedings of the 30th European Conference on Systems, Software and Services Process Improvement, EuroSPI 2023, held in Grenoble, France, in August-September 2023. The 47 full papers presented were carefully reviewed and selected from 100 submissions. The papers are organized according to the following topical sections: SPI and emerging and multidisciplinary approaches to software engineering; digitalisation of industry, infrastructure and e-mobility; SPI and good/bad SPI practices in improvement; SPI and functional safety and cybersecurity; SPI and agile; SPI and standards and safety and security norms; sustainability and life cycle challenges; SPI and recent innovations; virtual reality and augmented reality. .
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Holdings
Item type Home library Call number Status Notes Date due Barcode Item holds
e-Book e-Book S. R. Ranganathan Learning Hub Online Available Platform:Springer EB2004
Total holds: 0

This two-volume set constitutes the refereed proceedings of the 30th European Conference on Systems, Software and Services Process Improvement, EuroSPI 2023, held in Grenoble, France, in August-September 2023. The 47 full papers presented were carefully reviewed and selected from 100 submissions. The papers are organized according to the following topical sections: SPI and emerging and multidisciplinary approaches to software engineering; digitalisation of industry, infrastructure and e-mobility; SPI and good/bad SPI practices in improvement; SPI and functional safety and cybersecurity; SPI and agile; SPI and standards and safety and security norms; sustainability and life cycle challenges; SPI and recent innovations; virtual reality and augmented reality. .

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