TY  - BOOK
AU  - Patel, Ayush
AU  - R, Ravi K
AU  - Sengupta, Srijan
TI  - Copper Deposition Using Electrochemical 3D Printing
U1  - 621.988  
PY  - 2023///
CY  - Department of Metallurgical and Materials Engineering
PB  -  Indian Institute of Technology Jodhpurm
KW  - Department of Metallurgical and Materials Engineering
KW  - Copper Deposition
KW  - MTech Theses
ER  -