TY  - DATA
AU  - Lee, HoSung,
TI  - Thermal design: heat sinks, thermoelectrics, heat pipes, compact heat exchangers, and solar cells 
SN  - 9781119686040
U1  - 621.402 23/eng/20220324
PY  - 2022///
CY  - Hoboken, NJ, USA
PB  - John Wiley & Sons, Inc.
KW  - Heat engineering
KW  - Materials
KW  - Thermodynamics
KW  - Heat-transfer media
KW  - Thermoelectric apparatus and appliances
KW  - Thermique
KW  - Matériaux
KW  - Thermodynamique
KW  - Chaleur
KW  - Transmission
KW  - Milieux
KW  - Appareils thermoélectriques
KW  - thermodynamics
KW  - aat
KW  - fast
N1  - Includes bibliographical references and index
N2  - "In this significantly updated new edition, Thermal Design details the physical mechanisms of standard thermal devices while integrating essential formulas and detailed derivations to give a practical understanding of the field to students. The textbook examines the design of thermal devices through mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. Moreover, it presents information on significant thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems - all of which are increasingly important and fundamental to numerous fields such as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space."--
UR  - https://doi.org/10.1002/9781119686040
ER  -