In this work, we are preparing nanocomposites of Epoxy-Nanosilica for electronic packaging. The main objective is to develop a polymer composite with a high glass transition temperature (Tg around 230°C) and to ensure better dispersion quality of fillers. This study shows the effect of loading and quality of filler dispersion on the cured systems' glass transition temperature. Differential scanning calorimetry (DSC), Optical microscopy (OM), Fourier transform infrared spectroscopy - Attenuated total reflectance (FTIR-ATR), Optical profilometry, and Atomic force microscopy (AFM) are characterization techniques. Spin coater and homogenizer are processing tools used as part of this work to achieve this objective. The sample, when undergoing DSC, is prevented from leaking when subjected to step curing. The increase in the percentage of silica particles results in a higher glass transition temperature. The optical microscopy images showed clumps of nanosilica in epoxy resin. Good quality of coating was achieved when the sample was spin-coated.